InGaAs photodiodes offer superb response from 900nm to 1700nm, perfect for telecom and near IR detection. The 75 and 120 micron photodiodes are offered in isolated TO-46 packages with a lensed cap for single mode and multi-mode fiber coupling or Bare chips. These two sizes are also available with actively aligned FC receptacles. The 70 micron photodiode is perfect for high bandwidth applications while the 120 micron photodiode is perfect for active alignment applications. The 3mm photodiode is isolated in a TO-5 package with a broadband double sided AR-coated window. With the high shunt resistance, the 3mm photodiode is suitable for high sensitivity to weak signal applications.
Product model
| PD300 InGaAs Photodiode Chip |
PD300 | Response wavelngth 1000~1680nm, Material InGaAs, Active area 300um, Die Package, size 500μm×500μm （Min Order:100PCS） | Response wavelength: 1000-1680nm Material: InGaAs Active area: 300um |
Parameter
Features
● Response Range From 1000nm to 1680nm
● High Responsivity, front side illuminated，double-side pads
● Φ=300μm, round optical window
E/O Characteristics
The Opto-electronic Characteristics (@Tc=22±3℃)
Parameters | Sym. | Test conditions | Min | Typ | Max | Unit |
Response Spectrum | λ | - | 1000～1680 | nm |
Active Diameter | $ | - | 300 | μm |
Reponsivity | Re | λ=1.31μm, VR=5V, φe=100μW | 0.9 | - | - | A/W |
Forward Voltage | VF | IF=1mA | - | 0.6 | 0.7 | V |
Reverse Breakdown Voltage | VBR | ID=10μA, φe=0 | 35 | 40 | - | V |
Dark Current | ID | VR=5V, φe=0 | - | 0.2 | 0.8 | nA |
Capacitance | CPD | VR=5V, φe=0, f=1MHz | - | 5 | 8 | pF |
Rising Time/Falling Time | Tr/Tf | VR=5V, φe=1mW | - | 0.5 | 1 | ns |
DC Saturation Power | Sat | VR=0V | 1.0 | 2.5 | - | mW |
VR=5V | 6.0 | 14.0 | - |
Outline Diagram and Die Dimensions
Die Size | 500μm×500μm |
Die Thickess | 175±10μm |
Bond Pad Diameter | 75μm |
Photosensitive Diameter | 300μm |
Extend Electrode Length | 30μm |
P metal | Au |
N metal | Au |
Note: The structure of PIN PD is planar and front illuminated with P electrode on the top and N electrode on the bottom.
Absolute Maximum Rating
Parameter | Symbol | Rating | Unit |
Operating temperature | TC | -40～+85 | ℃ |
Storage temperature | TSTG | -50～+125 | ℃ |
Forward Current | IF | 10 | mA |
Reverse Current | IR | 10 | mA |
ESD susceptibility | ≥300 | V |
Matters needing attention:
a. Take appropriate ESD protections to avoid damage.
b. InP chips are fragile and easily damaged, so special caution should be used when handling.
c. Do not handle with tweezers. A vacuum tip with a flat surface is recommended. Bonding force and temperature should be applied in a gradual fashion.
Application
● Fiber communication
● Fiber sensor
Product model
PD300Response wavelength: 1000-1680nm
Material: InGaAs
Active area: 300um
Parameter
● Response Range From 1000nm to 1680nm
● High Responsivity, front side illuminated，double-side pads
● Φ=300μm, round optical window
The Opto-electronic Characteristics (@Tc=22±3℃)
Parameters
Sym.
Test conditions
Min
Typ
Max
Unit
Response Spectrum
λ
-
1000～1680
nm
Active Diameter
$
-
300
μm
Reponsivity
Re
λ=1.31μm, VR=5V, φe=100μW
0.9
-
-
A/W
Forward Voltage
VF
IF=1mA
-
0.6
0.7
V
Reverse Breakdown Voltage
VBR
ID=10μA, φe=0
35
40
-
V
Dark Current
ID
VR=5V, φe=0
-
0.2
0.8
nA
Capacitance
CPD
VR=5V, φe=0, f=1MHz
-
5
8
pF
Rising Time/Falling Time
Tr/Tf
VR=5V, φe=1mW
-
0.5
1
ns
DC Saturation Power
Sat
VR=0V
1.0
2.5
-
mW
VR=5V
6.0
14.0
-
Die Size
500μm×500μm
Die Thickess
175±10μm
Bond Pad Diameter
75μm
Photosensitive Diameter
300μm
Extend Electrode Length
30μm
P metal
Au
N metal
Au
Note: The structure of PIN PD is planar and front illuminated with P electrode on the top and N electrode on the bottom.
Absolute Maximum Rating
Parameter
Symbol
Rating
Unit
Operating temperature
TC
-40～+85
℃
Storage temperature
TSTG
-50～+125
℃
Forward Current
IF
10
mA
Reverse Current
IR
10
mA
ESD susceptibility
≥300
V
Matters needing attention:
a. Take appropriate ESD protections to avoid damage.
b. InP chips are fragile and easily damaged, so special caution should be used when handling.
c. Do not handle with tweezers. A vacuum tip with a flat surface is recommended. Bonding force and temperature should be applied in a gradual fashion.
● Fiber communication
● Fiber sensor